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Tag Archives: design conference

semip

Semi-Permanent 2013 book – submissions

Just a reminder that submissions for the 2013 Semi-Permanent book are closing shortly (on Monday 10 December).

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The Dieline Package Design Conference, Chicago – Day 3

The Dieline Package Design Conference, Chicago – Day 3

Lee Barnsley reports from The Dieline Package Design Conference in Chicago.

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The Dieline Package Design Conference, Chicago – Day 2

The Dieline Package Design Conference, Chicago – Day 2

Lee Barnsley reports from The Dieline Package Design Conference in Chicago.

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The Dieline Package Design Conference, Chicago – Day 1

The Dieline Package Design Conference, Chicago – Day 1

Lee Barnsley reports from The Dieline Package Design Conference in Chicago.

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agIdeas International Design Forum

agIdeas International Design Forum

Tickets are now on sale for agIdeas 2011 International Design Forum.

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